Integrated circuit inductors

ABSTRACT

The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

FIELD OF THE INVENTION

[0001] This invention relates to inductors, and more particularly, itrelates to inductors used with integrated circuits.

BACKGROUND OF THE INVENTION

[0002] Inductors are used in a wide range of signal processing systemsand circuits. For example, inductors are used in communication systems,radar systems, television systems, highpass filters, tank circuits, andbutterworth filters.

[0003] As electronic signal processing systems have become more highlyintegrated and miniaturized, effectively signal processing systems on achip, system engineers have sought to eliminate the use of large,auxiliary components, such as inductors. When unable to eliminateinductors in their designs, engineers have sought ways to reduce thesize of the inductors that they do use.

[0004] Simulating inductors using active circuits, which are easilyminiaturized, is one approach to eliminating the use of actual inductorsin signal processing systems. Unfortunately, simulated inductor circuitstend to exhibit high parasitic effects, and often generate more noisethan circuits constructed using actual inductors.

[0005] Inductors are miniaturized for use in compact communicationsystems, such as cell phones and modems, by fabricating spiral inductorson the same substrate as the integrated circuit to which they arecoupled using integrated circuit manufacturing techniques.Unfortunately, spiral inductors take up a disproportionately large shareof the available surface area on an integrated circuit substrate.

[0006] For these and other reasons there is a need for the presentinvention.

SUMMARY OF THE INVENTION

[0007] The above mentioned problems and other problems are addressed bythe present invention and will be understood by one skilled in the artupon reading and studying the following specification. An integratedcircuit inductor compatible with integrated circuit manufacturingtechniques is disclosed.

[0008] In one embodiment, an inductor capable of being fabricated from aplurality of conductive segments and interwoven with a substrate isdisclosed. In an alternate embodiment, a sense coil capable of measuringthe magnetic field or flux produced by an inductor comprised of aplurality of conductive segments and fabricated on the same substrate asthe inductor is disclosed.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009]FIG. 1A is a cutaway view of some embodiments of an inductor ofthe present invention.

[0010]FIG. 1B is a top view of some embodiments of the inductor of FIG.1A.

[0011]FIG. 1C is a side view of some embodiments of the inductor of FIG.1A.

[0012]FIG. 2 is a cross-sectional side view of some embodiments of ahighly conductive path including encapsulated magnetic material layers.

[0013]FIG. 3A is a perspective view of some embodiments of an inductorand a spiral sense inductor of the present invention.

[0014]FIG. 3B is a perspective view of some embodiments of an inductorand a non-spiral sense inductor of the present invention.

[0015]FIG. 4 is a cutaway perspective view of some embodiments of atriangular coil inductor of the present invention.

[0016]FIG. 5 is a top view of some embodiments of an inductor coupledcircuit of the present invention.

[0017]FIG. 6 is diagram of a drill and a laser for perforating asubstrate.

[0018]FIG. 7 is a block diagram of a computer system in whichembodiments of the present invention can be practiced.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0019] In the following detailed description of the preferredembodiments, reference is made to the accompanying drawings which form apart hereof, and in which is shown by way of illustration specificpreferred embodiments in which the invention may be practiced. Theseembodiments are described in sufficient detail to enable those skilledin the art to practice the invention, and it is to be understood thatother embodiments may be utilized and that logical, mechanical andelectrical changes may be made without departing from the spirit andscope of the present invention. The following detailed description is,therefore, not to be taken in a limiting sense, and the scope of thepresent invention is defined only by the appended claims.

[0020]FIG. 1A is a cutaway view of some embodiments of inductor 100 ofthe present invention. Inductor 100 includes substrate 103, a pluralityof conductive segments 106, a plurality of conductive segments 109, andmagnetic film layers 112 and 113. The plurality of conductive segments109 interconnect the plurality of conductive segments 106 to form highlyconductive path 114 interwoven with substrate 103. Magnetic film layers112 and 113 are formed on substrate 103 in core area 115 of highlyconductive path 114.

[0021] Substrate 103 provides the structure in which highly conductivepath 114 that constitutes an inductive coil is interwoven. Substrate103, in one embodiment, is fabricated from a crystalline material. Inanother embodiment, substrate 103 is fabricated from a single elementdoped or undoped semiconductor material, such as silicon or germanium.Alternatively, substrate 103 is fabricated from gallium arsenide,silicon carbide, or a partially magnetic material having a crystallineor amorphous structure. Substrate 103 is not limited to a single layersubstrate. Multiple layer substrates, coated or partially coatedsubstrates, and substrates having a plurality of coated surfaces are allsuitable for use in connection with the present invention. The coatingsinclude insulators, ferromagnetic materials, and magnetic oxides.Insulators protect the inductive coil and separate the electricallyconductive inductive coil from other conductors, such as signal carryingcircuit lines. Coatings and films of ferromagnetic materials, such asmagnetic metals, alloys, and oxides, increase the inductance of theinductive coil.

[0022] Substrate 103 has a plurality of surfaces 118. The plurality ofsurfaces 118 is not limited to oblique surfaces. In one embodiment, atleast two of the plurality of surfaces 118 are parallel. In an alternateembodiment, a first pair of parallel surfaces are substantiallyperpendicular to a second pair of surfaces. In still another embodiment,the surfaces are planarized. Since most integrated circuit manufacturingprocesses are designed to work with substrates having a pair ofrelatively flat or planarized parallel surfaces, the use of parallelsurfaces simplifies the manufacturing process for forming highlyconductive path 114 of inductor 100.

[0023] Substrate 103 has a plurality of holes, perforations, or othersubstrate subtending paths 121 that can be filled, plugged, partiallyfiled, partially plugged, or lined with a conducting material. In FIG.1A, substrate subtending paths 121 are filled by the plurality ofconducting segments 106. The shape of the perforations, holes, or othersubstrate subtending paths 121 is not limited to a particular shape.Circular, square, rectangular, and triangular shapes are all suitablefor use in connection with the present invention. The plurality ofholes, perforations, or other substrate subtending paths 121, in oneembodiment, are substantially parallel to each other and substantiallyperpendicular to substantially parallel surfaces of the substrate.

[0024] Highly conductive path 114 is interwoven with a single layersubstrate or a multilayer substrate, such as substrate 103 incombination with magnetic film layers 112 and 113, to form an inductiveelement that is at least partially embedded in the substrate. If thesurface of the substrate is coated, for example with magnetic film 112,then conductive path 114 is located at least partially above thecoating, pierces the coated substrate, and is interlaced with the coatedsubstrate.

[0025] Highly conductive path 114 has an inductance value and is in theshape of a coil. The shape of each loop of the coil interlaced with thesubstrate is not limited to a particular geometric shape. For example,circular, square, rectangular, and triangular loops are suitable for usein connection with the present invention.

[0026] Highly conductive path 114, in one embodiment, intersects aplurality of substantially parallel surfaces and fills a plurality ofsubstantially parallel holes. Highly conductive path 114 is formed froma plurality of interconnected conductive segments. The conductivesegments, in one embodiment, are a pair of substantially parallel rowsof conductive columns interconnected by a plurality of conductivesegments to form a plurality of loops.

[0027] Highly conductive path 114, in one embodiment, is fabricated froma metal conductor, such as aluminum, copper, or gold or an alloy of asuch a metal conductor. Aluminum, copper, or gold, or an alloy is usedto fill or partially fill the holes, perforations, or other pathssubtending the substrate to form a plurality of conductive segments.Alternatively, a conductive material may be used to plug the holes,perforations, or other paths subtending the substrate to form aplurality of conductive segments. In general, higher conductivitymaterials are preferred to lower conductivity materials. In oneembodiment, conductive path 114 is partially diffused into the substrateor partially diffused into the crystalline structure.

[0028] For a conductive path comprised of segments, each segment, in oneembodiment, is fabricated from a different conductive material. Anadvantage of interconnecting segments fabricated from differentconductive materials to form a conductive path is that the properties ofthe conductive path are easily tuned through the choice of theconductive materials. For example, the internal resistance of aconductive path is increased by selecting a material having a higherresistance for a segment than the average resistance in the rest of thepath. In an alternate embodiment, two different conductive materials areselected for fabricating a conductive path. In this embodiment,materials are selected based on their compatibility with the availableintegrated circuit manufacturing processes. For example, if it isdifficult to create a barrier layer where the conductive path piercesthe substrate, then the conductive segments that pierce the substrateare fabricated from aluminum. Similarly, if it is relatively easy tocreate a barrier layer for conductive segments that interconnect thesegments that pierce the substrate, then copper is used for thesesegments.

[0029] Highly conductive path 114 is comprised of two types ofconductive segments. The first type includes segments subtending thesubstrate, such as conductive segments 106. The second type includessegments formed on a surface of the substrate, such as conductivesegments 109. The second type of segment interconnects segments of thefirst type to form highly conductive path 114. The mid-segmentcross-sectional profile 124 of the first type of segment is not limitedto a particular shape. Circular, square, rectangular, and triangular areall shapes suitable for use in connection with the present invention.The mid-segment cross-sectional profile 127 of the second type ofsegment is not limited to a particular shape. In one embodiment, themid-segment cross-sectional profile is rectangular. The coil thatresults from forming the highly conductive path from the conductivesegments and interweaving the highly conductive path with the substrateis capable of producing a reinforcing magnetic field or flux in thesubstrate material occupying the core area of the coil and in anycoating deposited on the surfaces of the substrate.

[0030]FIG. 1B is a top view of FIG. 1A with magnetic film 112 formed onsubstrate 103 between conductive segments 109 and the surface ofsubstrate 103. Magnetic film 112 coats or partially coats the surface ofsubstrate 103. In one embodiment, magnetic film 112 is a magnetic oxide.In an alternate embodiment, magnetic film 112 is one or more layers of amagnetic material in a plurality of layers formed on the surface ofsubstrate 103.

[0031] Magnetic film 112 is formed on substrate 103 to increase theinductance of highly conductive path 114. Methods of preparing magneticfilm 112 include evaporation, sputtering, chemical vapor deposition,laser ablation, and electrochemical deposition. In one embodiment, highcoercivity gamma iron oxide films are deposited using chemical vaporpyrolysis. When deposited at above 500 degrees centigrade these filmsare magnetic gamma oxide. In an alternate embodiment, amorphous ironoxide films are prepared by the deposition of iron metal in an oxygenatmosphere (10⁻⁴ torr) by evaporation. In another alternate embodiment,an iron-oxide film is prepared by reactive sputtering of an Fe target inAr+O₂ atmosphere at a deposition rate of ten times higher than theconventional method. The resulting alpha iron oxide films are thenconverted to magnetic gamma type by reducing them in a hydrogenatmosphere.

[0032]FIG. 1C is a side view of some embodiments of the inductor of FIG.1A including substrate 103, the plurality of conductive segments 106,the plurality of conductive segments 109 and magnetic films 112 and 113.

[0033]FIG. 2 is a cross-sectional side view of some embodiments ofhighly conductive path 203 including encapsulated magnetic materiallayers 206 and 209. Encapsulated magnetic material layers 206 and 209,in one embodiment, are a nickel iron alloy deposited on a surface ofsubstrate 212. Formed on magnetic material layer layers 206 and 209 areinsulating layers 215 and 218 and second insulating layers 221 and 224which encapsulate highly conductive path 203 deposited on insulatinglayers 215 and 218. Insulating layers 215, 218, 221 and 224, in oneembodiment are formed from an insulator, such as polyimide. In analternate embodiment, insulating layers 215, 218, 221, and 224 are aninorganic oxide, such as silicon dioxide or silicon nitride. Theinsulator may also partially line the holes, perforations, or othersubstrate subtending paths. The purpose of insulating layers 215 and218, which in one embodiment are dielectrics, is to electrically isolatethe surface conducting segments of highly conductive path 203 frommagnetic material layers 206 and 209. The purpose of insulating layers221 and 224 is to electrically isolate the highly conductive path 203from any conducting layers deposited above the path 203 and to protectthe path 203 from physical damage.

[0034] The field created by the conductive path is substantiallyparallel to the planarized surface and penetrates the coating. In oneembodiment, the conductive path is operable for creating a magneticfiled within the coating, but not above the coating. In an alternateembodiment, the conductive path is operable for creating a reinforcingmagnetic field within the film and within the substrate.

[0035]FIG. 3A and FIG. 3B are perspective views of some embodiments ofinductor 301 and sense inductors 304 and 307 of the present invention.In one embodiment, sense inductor 304 is a spiral coil and senseinductor 307 is a test inductor or sense coil embedded in the substrate.Sense inductors 304 and 307 are capable of detecting and measuringreinforcing magnetic field or flux 310 generated by inductor 301, and ofassisting in the calibration of inductor 301. In one embodiment, senseinductor 304 is fabricated on one of the surfaces substantiallyperpendicular to the surfaces of the substrate having the conductingsegments, so magnetic field or flux 310 generated by inductor 301 issubstantially perpendicular to sense inductor 304. Detachable test leads310 and 313 in FIG. 3A and detachable test leads 316 and 319 in FIG. 3Bare capable of coupling sense inductors 304 and 307 to sense ormeasurement circuits. When coupled to sense or measurement circuits,sense inductors 304 and 307 are decoupled from the sense or measurementcircuits by severing test leads 310, 313, 316, and 319. In oneembodiment, test leads 310, 313, 316, and 316 are severed using a laser.

[0036] In accordance with the present invention, a current flows ininductor 301 and generates magnetic field or flux 310. Magnetic field orflux 310 passes through sense inductor 304 or sense inductor 307 andinduces a current in spiral sense inductor 304 or sense inductor 307.The induced current can be detected, measured and used to deduce theinductance of inductor 301.

[0037]FIG. 4 is a cutaway perspective view of some embodiments oftriangular coil inductor 400 of the present invention. Triangular coilinductor 400 comprises substrate 403 and triangular coil 406. Anadvantage of triangular coil inductor 400 is that it saves at least aprocess step over the previously described coil inductor. Triangularcoil inductor 400 only requires the construction of three segments foreach coil of inductor 400, where the previously described inductorrequired the construction of four segments for each coil of theinductor.

[0038]FIG. 5 is a top view of some embodiments of an inductor coupledcircuit 500 of the present invention. Inductor coupled circuit 500comprises substrate 503, coating 506, coil 509, and circuit or memorycells 512. Coil 509 comprises a conductive path located at leastpartially above coating 506 and coupled to circuit or memory cells 512.Coil 509 pierces substrate 503, is interlaced with substrate 503, andproduces a magnetic field in coating 506. In an alternate embodiment,coil 509 produces a magnetic field in coating 506, but not above coating506. In one embodiment, substrate 503 is perforated with a plurality ofsubstantially parallel perforations and is partially magnetic. In analternate embodiment, substrate 503 is a substrate as described above inconnection with FIG. 1. In another alternate embodiment, coating 506 isa magnetic film as described above in connection with FIG. 1. In anotheralternate embodiment, coil 509, is a highly conductive path as describedin connection with FIG. 1.

[0039]FIG. 6 is a diagram of a drill 603 and a laser 606 for perforatinga substrate 609. Substrate 609 has holes, perforations, or othersubstrate 609 subtending paths. In preparing substrate 609, in oneembodiment, a diamond tipped carbide drill is used bore holes or createperforations in substrate 609. In an alternate embodiment, laser 606 isused to bore a plurality of holes in substrate 609. In a preferredembodiment, holes, perforations, or other substrate 609 subtending pathsare fabricated using a dry etching process.

[0040]FIG. 7 is a block diagram of a system level embodiment of thepresent invention. System 700 comprises processor 705 and memory device710, which includes memory circuits and cells, electronic circuits,electronic devices, and power supply circuits coupled to inductors ofone or more of the types described above in conjunction with FIGS. 1A-5.Memory device 710 comprises memory array 715, address circuitry 720, andread circuitry 730, and is coupled to processor 705 by address bus 735,data bus 740, and control bus 745. Processor 705, through address bus735, data bus 740, and control bus 745 communicates with memory device710. In a read operation initiated by processor 705, addressinformation, data information, and control information are provided tomemory device 710 through busses 735, 740, and 745. This information isdecoded by addressing circuitry 720, including a row decoder and acolumn decoder, and read circuitry 730. Successful completion of theread operation results in information from memory array 715 beingcommunicated to processor 705 over data bus 740.

Conclusion

[0041] Embodiments of inductors and methods of fabricating inductorssuitable for use with integrated circuits have been described. In oneembodiment, an inductor having a highly conductive path fabricated froma plurality of conductive segments, and including coatings and films offerromagnetic materials, such as magnetic metals, alloys, and oxides hasbeen described. In another embodiment, an inductor capable of beingfabricated from a plurality of conductors having different resistanceshas been described. In an alternative embodiment, an integrated test orcalibration coil capable of being fabricated on the same substrate as aninductor and capable of facilitating the measurement of the magneticfield or flux generated by the inductor and capable of facilitating thecalibration the inductor has been described.

[0042] Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement which is calculated to achieve the same purpose maybe substituted for the specific embodiment shown. This application isintended to cover any adaptations or variations of the presentinvention. Therefore, it is manifestly intended that this invention belimited only by the claims and the equivalents thereof.

What is claimed is:
 1. An inductor comprising: a substrate; aferromagnetic layer in contact with the substrate; and a highlyconductive path interwoven with the substrate.
 2. The inductor of claim1 wherein the substrate is a semiconductor.
 3. The inductor of claim 2 ,further comprising: an insulating layer and a magnetic material layerformed on the substrate between the highly conductive path and thesubstrate.
 4. The inductor of claim 3 , wherein the insulating layer isa dielectric.
 5. An inductor comprising: a substrate; and a highlyconductive path having an inductance value, and the highly conductivepath comprising a plurality of interconnected conductive segmentsinterwoven with the substrate, wherein each of the plurality ofinterconnected conductive segments has a mid-segment cross sectionprofile selected from the group consisting of circular and rectangular.6. The inductor of claim 5 , wherein each of the plurality ofinterconnected conductive segments is fabricated from a different metal.7. The inductor of claim 5 , wherein each of the plurality ofinterconnected conductive segments is fabricated from one of twodifferent metals.
 8. An inductor comprising: a semiconductor substratehaving a crystalline structure and a plurality of perforations; and ahighly conductive metal path woven through the plurality of perforationsof the semiconductor substrate, and at least partially diffused into thecrystalline structure.
 9. The inductor of claim 8 , wherein thesemiconductor is germanium.
 10. The inductor of claim 9 , wherein thehighly conductive metal path is fabricated from copper.
 11. The inductorof claim 8 , further comprising: an insulating material partiallyfilling each of the plurality of perforations.
 12. The inductor of claim11 , wherein the insulating material is polyimide.
 13. An inductorcomprising: a substrate; and a plurality of copper segmentsinterconnected with and alternating with a plurality of conductivesegments to form a highly conductive coil.
 14. An inductor comprising: asubstrate; an inductive structure having an inductance of at least 0.1nanohenrys partially embedded in the substrate.
 15. The inductor ofclaim 14 , wherein the inductive structure is a coil.
 16. The inductorof claim 14 , further comprising: a coating covering the inductivestructure.
 17. The inductor of claim 16 , wherein the coating is aninsulator and capable of protecting the inductive structure from damage.18. An inductor comprising: a perforated substrate; and a triangularcoil having an inductance of at least 0.3 nanohenrys interlaced with theperforated substrate.
 19. The inductor of claim 18 , wherein theperforated substrate is silicon carbide.
 20. The inductor of claim 18 ,further comprising: at least one test lead attached to the coil.
 21. Theinductor of claim 20 , wherein the pair of test lead is capable of beingdecoupled from the coil using a laser.
 22. An inductor comprising: asemiconductor substrate; a conductive path through the semiconductorsubstrate and operable for creating a reinforcing magnetic flux withinthe semiconductor substrate.
 23. The inductor of claims 22, wherein thesemiconductor substrate is silicon.
 24. The inductor of claim 22 ,further comprising: a test coil embedded in the substrate for measuringthe reinforcing magnetic flux.
 25. The inductor of claim 24 , whereinthe test coil is fabricated from gold.
 26. The inductor of claim 25 ,wherein the test coil is initially fabricated as part of the conductivepath and then decoupled from the conductive path.
 27. An inductorcomprising: a substrate; a pair of substantially parallel rows ofconductive columns providing a conductive path through the substrate;and a plurality of conductive segments interconnecting the pair ofsubstantially parallel rows of conductive columns to form a coil. 28.The inductor of claim 27 , wherein the substrate has a plurality ofsubstantially planarized surfaces.
 29. The inductor of claim 27 ,wherein the columns are substantially perpendicular to at least two ofthe substantially planarized surfaces.
 30. The inductor of claim 29 ,wherein a test coil is fabricated on one of the substantially planarizedsurfaces.
 31. The inductor of claim 30 , wherein the test coil is aspiral coil.
 32. An inductor comprising: a perforated substrate; and aconductive material interwoven with the perforated substrate and atleast partially diffused into the perforated substrate.
 33. The inductorof claim 32 , wherein the conductive material is gold.
 34. The inductorof claim 32 , wherein the perforated substrate comprises a plurality ofperforations having a circular shape.
 35. An inductor comprising: asubstrate having a plurality of substantially parallel holes, aplurality of substantially parallel surfaces, and a second plurality ofsubstantially parallel surfaces approximately perpendicular to theplurality of substantially parallel surfaces; a coil intersecting theplurality of substantially parallel surfaces and filling the pluralityof substantially parallel holes; and at least two leads operable forcoupling to the coil from at least one of the second plurality ofsubstantially parallel surfaces.
 36. An inductor comprising: a substratehaving a plurality of holes and a plurality of surfaces; a conductivematerial having a conductivity of at least copper and filling at leastthree of the plurality of holes to form a plurality of conductivesegments; and a plurality of conductive interconnects formed on at leastone of the plurality of surfaces and coupling to the plurality ofconductive segments to form a continuous conductive coil.
 37. Aninductor comprising: a substrate having a plurality of perforations anda plurality of layers; and a conductive material interwoven with thesubstrate through the plurality of perforations and operable forproducing a reinforcing magnetic field in the plurality of layers. 38.The inductor of claim 37 , wherein at least one of the plurality oflayers is a magnetic film.
 39. The inductor of claim 38 , wherein themagnetic film is a magnetic oxide.
 40. The inductor of claim 37 ,wherein at least one of the plurality of layers is fabricated fromnickel and iron.
 41. An inductor comprising: a coil having a core area;and a partially coated substrate filling the core area.
 42. An inductorcomprising: a coil operable for creating a magnetic flux; and asubstrate having a surface coating coupled to the magnetic flux.
 43. Theinductor of claim 42 , wherein the surface coating is a magneticmaterial.
 44. The inductor of claim 43 , wherein the coil comprises aplurality of interconnected metal segments fabricated from a materialselected form the group consisting of gold and copper.
 45. An inductorcomprising: a multilayer substrate; and a coil interwoven with themultilayer substrate.
 46. An inductor comprising: a substrate having aplurality of surfaces where at least one of the plurality of surfaces isplanarized and has a coating; and a coil operable for generating amagnetic field that is substantially parallel to the planarized surfaceand that penetrates the coating, the coil is partially embedded in thesubstrate.
 47. An integrated circuit comprising: a perforated substratehaving a circuit formed on the perforated substrate and having aplurality of surfaces where at least one of the plurality of surfaceshas a coating; and a coil located partially above the coating and thecoil operably coupled to the circuit.
 48. The integrated circuit ofclaim 47 , wherein the coil has a length and less than about twentypercent of the length of the coil is located above the coating.
 49. Anintegrated circuit comprising: a coated substrate having a circuitformed on the coated substrate and having a plurality of substantiallyparallel perforations; and a coil routed through the plurality ofsubstantially parallel perforations, and the coil operably coupled tothe circuit.
 50. An integrated circuit comprising: a partially magneticsubstrate having a circuit formed thereon; and a conductive materialinterwoven with the partially magnetic substrate and operable forgenerating a magnetic field in the partially magnetic substrate, and theconductive material operably coupled to the circuit.
 51. An integratedcircuit comprising: a substrate having a coating; a circuit formed onthe substrate; and a conductive path operable for creating a magneticfield in the coating, and coupled to the circuit.
 52. A memory systemcomprising: a substrate having a plurality of memory cells and acoating; and a conductive path interwoven with the substrate andoperable for creating a magnetic field in the coating but not above thecoating.
 53. A memory system comprising: a coated substrate having anumber of memory cells; and an inductive structure having an inductanceof at least 0.5 nanohenrys piercing the coated substrate and interlacedwith the coated substrate and interconnected with at least one of thenumber of memory cells.
 54. A memory system comprising: a substratehaving a plurality of holes and a plurality of memory circuits; amagnetic film formed on the substrate; and a conductive path interwovenwith the substrate and the magnetic film by routing the conductive paththrough the plurality of holes.
 55. A computer system comprising: aprocessor; an inductive element comprising: a substrate having a pair ofrows of a plurality of substantially parallel perforations; a magneticfilm on the substrate; and a conductive path interlaced with thesubstrate through the plurality of substantially parallel perforations;and an electronic device coupled to the inductive element and theprocessor.
 56. A computer system comprising: a processor; an inductorcomprising: a substrate; a magnetic film on the substrate; and aconductive path operable for creating a reinforcing magnetic fieldwithin the magnetic film and within the substrate; and an electroniccircuit operably coupled to the processor and the inductor.
 57. Ancomputer system comprising: a processor; an inductor comprising: asubstrate; a magnetic film on the substrate; and a conductive pathinterwoven with the substrate and operable for creating a magnetic fieldin the magnetic film; and a power supply circuit coupled to the inductorand the processor.
 58. A method comprising: boring a plurality of holesin a substratum; and fabricating a conductive path linking the pluralityof holes.
 59. The method of claim 58 , wherein boring a plurality ofhoes in the substratum comprises: positioning a drill on the substratum;and drilling a hole in the substratum.
 60. The method of claim 58 ,wherein boring a plurality of hoes in the substratum comprises: aiming alaster at the substratum; and burning a hole in the substratum.
 61. Amethod comprising; boring a number of substantially parallel holes in asubstrate having a coating; depositing a conductive path linking thenumber of holes and operable for inducing a magnetic flux in thecoating.
 62. The method of claim 61 , wherein depositing a conductivepath comprises: filling the holes with a conductive material; andconnecting the holes with a conductive material.
 63. A methodcomprising: drilling a plurality of holes in a substrate; filling theplurality of holes with a conductive material to form a plurality ofconductive segments; and interconnecting the plurality of conductivesegments to form a coil.
 64. A method comprising: boring a plurality forsubstantially parallel perforations in a substrate having a pair ofsubstantially parallel surfaces; plugging the plurality of substantiallyparallel perforations with a highly conductive material to form a highlyconductive segment; and interconnecting the plurality of highlyconductive segments to form a conductive path operable for producing areinforcing magnetic field.
 65. A method comprising: drilling aplurality of substantially parallel holes in a substrate having aplurality of substantially parallel surfaces; coating at least one ofthe substantially parallel surfaces with a magnetic material; fillingthe plurality of substantially parallel holes with a conductor to form aconductive segment; and interconnecting the plurality of conductivesegments to form a coil operable for producing a magnetic field in thecoating.
 66. A method comprising: piercing a substrate having aplurality of substantially parallel surfaces to form a plurality ofsubstantially parallel perforations; coating at least one of thesubstantially parallel surfaces with an insulating film; coating theinsulating film with a magnetic film; coating the magnetic film with aninsulating material; depositing in at least two of the plurality ofsubstantially parallel perforations a conductor to form a plurality ofconductive segments; and coupling the plurality of conductive segmentswith a conductive material to form a loop.